Ximen Digital Industrial Software recently launched two new solutions for the electronic design automation (EDA) product portfolio to help the semiconductor design teams face complex challenges in the design and manufacturing of 2.5D and 3D integrated circuits (ICs).
Ximun's new Innovator3D IC™ solution suite helps IC designers efficiently develop, simulate and manage different-integrated 2.5D/3D-IC designs. In addition, the new Calibre 3DStress software uses advanced thermal mechanical analysis to identify the electrical effects of stress at the transistor level. The application of two solutions can significantly reduce the complex design risks of the next generation 2.5D/3D ICs and improve design quality, yield and reliability.
West Digital Industrial Software, Mike Ellow, executive director of Westmen EDA, said that by combining stress-aware multiphysics analysis solutions driven by Calibre 3DStress and Innovator3D IC solution suite, it will help customers overcome the complexity and risks brought by 3D IC design. These functions can help customers effectively eliminate design complex obstacles that traditionally affect the design cycle, improve production capacity and achieve strict design process requirements.
The new Innovator3D IC solution suite provides a fast and predictable path for different design planning and integration, substrate/mediary layer implementation, interface agreement analysis and data management, and design and IP. Based on user experience with converged AI, the suite has extensive multi-operation and multi-core capabilities to provide optimal capacity and performance for over 5 million foot-inducing designs.
In addition, as chips with 2.5D/3D IC architectures are becoming increasingly thin and the packaging process temperature continues to increase, IC designers have discovered that designs that have been certified and tested during grain development often no longer meet the specifications after packaging and reflow. In this regard, Ximen launched Calibre 3DStress, which supports precise transistor analysis, verification and error removal of thermal mechanical stress and tumbling deformation in 3D IC packaging scenarios, helping designers evaluate the impact of the interaction between chip and packaging on design functions early in the development cycle. It not only prevents future failures, but also optimizes the design to improve performance and durability.
Calibre 3DStress Assist 3D IC Design ReliabilityAfter launching the Calibre 3D Thermal in 2024, Calibre 3DStress further expanded the multiphysical understanding decisions, significantly reducing the impact of heat and mechanical, and revealing the visibility of design and electronic behavior early in the design process. Unlike packaging-level stress analysis tools, Calibre 3DStress’s uniqueness lies in its ability to detect transistor-level stress and verify whether packaging and product functions will harm circuit performance.
Calibre 3DStress is an important link in the Ximen 3D IC multi-physical software product combination and is also the basic core of its IC digital education and semiconductor development workflow. It provides an innovative combination of industry-standard Calibre physics verification capabilities with a native and highly advanced mechanical solver to evaluate the stress in IC structures and materials.
Stmacroelectronics APMS Central R&D Sandro Dalle Feste pointed out that Ximen EDA's Calibre 3DStress tool can comprehensively analyze the complexity of components, materials and processes related to 3D IC architectures, and achieve accurate IP-level stress analysis. Through this tool, STMicroelectronics can implement early design planning and sign-off processes, and accurately simulate potential electrical failure situations caused by IP-level stress in 3D IC packaging, helping to improve reliability and quality, while shortening the launch process, creating a dual win between STMicroelectronics and customers.
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