Dragon Foundry Longtou TEK announced in March 2025 that it plans to invest US$10 billion in advanced semiconductor manufacturing in the United States, including 3 new round factories, 2 advanced packaging facilities and 1 major R&D center. In the past few months, NTU has accelerated the construction progress of Fab 21, Phoenix, Arizona, and has started construction of the third crystal factory.
In this regard, according to ComputerBase reports, NTU plans to build two special buildings near Fab 21 and provide advanced packaging services locally. The first advanced packaging facility AP1 project starts in 2028, synchronized with the third stage construction project of Fab 21, and can serve N2 and more advanced A16 process technology. The second advanced packaging facility AP2 will be synchronized with the fourth/5th stage of Fab 21, but there is no specific operating date yet.
As for the two advanced packaging facilities, the two advanced packaging facilities will focus on CoPoS and SoIC packaging technologies. Among them, the CoPoS advanced packaging will use a 310×310 mm rectangular panel instead of the traditional round wafer, that is, CoWoS "panelized", arrange the wafers in a square "panel RDL layer", and replace the original round "silicon interposer", and improve area utilization and production capacity through "circularization".
The advanced SoIC packaging technology is to stack storage or memory chips under the computing core, which has been verified in the AMD Ryzen X3D processor. Taiwan Electronics Project launches CoPoS testing production in 2026, with the goal of completing verification work with partners by the end of 2027 to ensure orders from major customers including NVIDIA, AMD and Apple.
The report pointed out that since AP1 is expected to start operating until the end of 2029 or early 2030, this is consistent with the delivery time practice of NTU.